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Date: 2013-08-01

Upsite Technologies Announces Two New HotLok® Sealing Solutions

Upsite Technologies®, Inc. recently announced the new HotLok Full Rack Blanking Panel (FRBP) Kit and the Rack Airflow Management (RAM) Kit


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Hot Products:
Product Model Inside Diameter Outside Diameter Thickness
5213N NACHI 65 120 38.1
5312N NACHI 60 130 54
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